Zuverlaessigkeit mechatronischer Systeme: Bewertung der Lebensdauer der Leistungselektronik

Seliger, Norbert (2012)

Planar Interconnect Technology for Power Module System Integration (Invited)

Weidner, K; Kaspar, M; Seliger, Norbert (2012)

Proceedings of 7th International Conference on Integrated Power Electronics Systems.

Innovative Leistungsmodule

Weidner, K; Kaspar, M; Seliger, Norbert (2011)

Produktion von Leiterplatten und Systemen (PLUS) 13, 1408-1412.

Dual Rosenheim Model: Mechatronics Degree Program at Rosenheim University of Applied Sciences Why Mechatronics?

Versen, M; Schinagl, Stefan; Seliger, Norbert; Wagner, M; Ploetz, F (2010)

Atp Edition.

Reliability of high temperature inverters for HEV

Renken, F; Ehbauer, G; Karrer, V; Knorr, R; Ramminger, S; Seliger, Norbert; Wolfgang, E (2007)

Renken, F; Ehbauer, G; Karrer, V; Knorr, R; Ramminger, S; Seliger, Norbert...

POWER CONVERSION CONFERENCE - NAGOYA, VOLS 1-3.

Magnetic component miniaturisation for application in power electronic modules

Gerber, M; Seliger, Norbert; Ferreira, J; Hofsajer, I (2006)

Proc. CIPS 2006.

Design and evaluation of an automotive integrated system module

Gerber, M; Ferreira, JA; Seliger, Norbert; Hofsajer, IW (2005)

IEEE Industry Applications Society Annual Meeting.

High density packaging of the passive components in an automotive DC/DC converter

Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, Norbert (2005)

IEEE Transactions on Power Electronics.
DOI: 10.1109/TPEL.2004.843020

Integral 3-D thermal, electrical and mechanical design of an automotive DC/DC converter

Gerber, M; Ferreira, JA; Seliger, Norbert; Hofsajer, IW (2005)

IEEE Transactions on Power Electronics.
DOI: 10.1109/TPEL.2005.846557

Integral design of a high power density DC/DC converter for harsh environments

Gerber, M; Ferreira, J; Hofsajer, I; Seliger, Norbert (2005)

Proc. EPE'05.

A high-density heat-sink-mounted inductor for automotive applications

Gerber, M; Abraham, JA; Hofsajer, IW; Seliger, Norbert (2004)

IEEE Transactions on Industry Applications.
DOI: 10.1109/TIA.2004.830766

A new integrated packaging technology for high-power automotive electronics

Hofsajer, IW; Gerber, M; Ferreira, JA; Seliger, Norbert (2004)

South African Journal of Science.

An improved 3D integrated DC/DC converter for high temperature environments

Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, Norbert (2004)

Proceedings of the IEEE Power Electronics Specialists Conference.
DOI: 10.1109/PESC.2004.1355273

EMC-optimised design of a converter power stage by reduction of surface currents

Rohrich, A; Hirsch, H; Seliger, Norbert (2004)

IEEE Power Electronics Specialists Conference.
DOI: 10.1109/PESC.2004.1355718

Interleaving optimization in synchronous rectified DC/DC converters

Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, Norbert (2004)

Proceedings of the IEEE Power Electronics Specialists Conference.
DOI: 10.1109/PESC.2004.1354823

A new integrated packaging technology for high-power automative electronics

Hofsajer, IW; Gerber, MB; Ferreira, JA; Seliger, Norbert (2004)

South African Journal of Science 100, 273–278.

EMV-optimierter Entwurf durch gezielte Reduktion von Oberflaechenstroemen

Hirsch, H; Roehrich, A; Seliger, Norbert (2004)

Elektromagnetische Vertraeglichkeit, 12. Internationale Fachmesse und Kongress fuer Elektromagnetische Vertraeglichkeit.

High temperature reliability on automotive power modules verified by power cycling tests up to 150 degrees C

Coquery, G; Lefranc, G; Licht, T; Lallemand, R; Seliger, Norbert; Berg, H (2003)

Microelectronics Reliability.
DOI: 10.1016/S0026-2714(03)00318-4

High temperature, high power density packaging for automotive applications

Gerber, M; Ferreira, JA; Hofsajer, IW; Seliger, Norbert (2003)

Proceedings of the IEEE Power Electronics Specialists Conference.

Hot-spot measurements and analysis of electro-thermal effects in low-voltage power-MOSFET's

Castellazzi, A; Kartal, V; Kraus, R; Seliger, Norbert; Honsberg-Riedl, M; Schmitt-Landsiedel, D (2003)

Castellazzi, A; Kartal, V; Kraus, R; Seliger, Norbert; Honsberg-Riedl, M...

Microelectronics Reliability.
DOI: 10.1016/S0026-2714(03)00319-6