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Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices
more| Titel | Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices |
|---|---|
| Medien | Journal of Electrostatics |
| Verfasser | C Furbock, D Pogany, M Litzenberger, E Gornik, Prof. Dr. techn. Norbert Seliger, H Gossner, T Muller-Lynch, M Stecher, W Werner |
| Veröffentlichungsdatum | 2000 |
| Zitation | Furbock, C; Pogany, D; Litzenberger, M; Gornik, E; Seliger, Norbert; Gossner, H; Muller-Lynch, T; Stecher, M; Werner, W (2000): Interferometric temperature mapping during ESD stress and failure analysis of smart power technology ESD protection devices. Journal of Electrostatics. DOI: 10.1016/S0304-3886(00)00024-3 |