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High temperature reliability on automotive power modules verified by power cycling tests up to 150 degrees C
more| Titel | High temperature reliability on automotive power modules verified by power cycling tests up to 150 degrees C |
|---|---|
| Medien | Microelectronics Reliability |
| Verfasser | G Coquery, G Lefranc, T Licht, R Lallemand, Prof. Dr. techn. Norbert Seliger, H Berg |
| Veröffentlichungsdatum | 2003 |
| Zitation | Coquery, G; Lefranc, G; Licht, T; Lallemand, R; Seliger, Norbert; Berg, H (2003): High temperature reliability on automotive power modules verified by power cycling tests up to 150 degrees C. Microelectronics Reliability. DOI: 10.1016/S0026-2714(03)00318-4 |