Simulation-Based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones

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Titel Simulation-Based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones
Medien 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC)
Verfasser M.Eng. Yogesh Babu, Sebastian Kisban, Prof. Dr.-Ing. Matthias Winter, Prof. Dr.-Ing. Gregor Feiertag, Margarita Chizh, Matthias Schmidt, Bogdan Tanc, Sushil Bharatan, Tomas Pitak, Daniel Hajtas
Seiten 1-8
Veröffentlichungsdatum 15.09.2025
Zitation Babu, Yogesh; Kisban, Sebastian; Winter, Matthias; Feiertag, Gregor; Chizh, Margarita; Schmidt, Matthias; Tanc, Bogdan; Bharatan, Sushil; Pitak, Tomas; Hajtas, Daniel (2025): Simulation-Based Analysis of Thermal Effects Induced by RF Interference in MEMS Microphones. 2025 25th European Microelectronics and Packaging Conference & Exhibition (EMPC), 1-8. DOI: 10.23919/empc63132.2025.11222556