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Interferometric temperature mapping during ESD stress and failure analysis of Smart Power technology ESD protection devices
mehr| Titel | Interferometric temperature mapping during ESD stress and failure analysis of Smart Power technology ESD protection devices |
|---|---|
| Medien | ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM PROCEEDINGS |
| Verfasser | C Furbock, D Pogany, M Litzenberger, E Gornik, Prof. Dr. techn. Norbert Seliger, H Gossner, T Muller-Lynch, M Stecher, W Werner |
| Veröffentlichungsdatum | 1999 |
| Zitation | Furbock, C; Pogany, D; Litzenberger, M; Gornik, E; Seliger, Norbert; Gossner, H; Muller-Lynch, T; Stecher, M; Werner, W (1999): Interferometric temperature mapping during ESD stress and failure analysis of Smart Power technology ESD protection devices. ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM PROCEEDINGS. DOI: 10.1109/EOSESD.1999.819067 |