Power cycling and temperature endurance test of a GaN switching cell with substrate integrated chips

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Titel Power cycling and temperature endurance test of a GaN switching cell with substrate integrated chips
Medien Microelectronics Reliability
Verfasser Eduard Dechant, Prof. Dr. techn. Norbert Seliger, Prof. Dr.-Ing. Ralph Kennel
Veröffentlichungsdatum 2019
Zitation Dechant, Eduard; Seliger, Norbert; Kennel, Ralph (2019): Power cycling and temperature endurance test of a GaN switching cell with substrate integrated chips. Microelectronics Reliability. DOI: 10.1016/J.MICROREL.2019.06.064